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NOIH2SM1000A
TABLES AND FIGURES
Specification Tables
Table 10. TYPE VARIANT SUMMARY
HAS2 Type Variants
Optical quality (see Optical Quality ? Definitions on page 67)
Dead pixels
Bright pixels in FPN image
Bad pixels in PRNU image
Bad columns
Bad rows
Bright pixel clusters
2 adjacent bright pixels
4 or more adjacent bright pixels
DSNU defects at 22 dec BOL
DSNU defects at 22 dec EOL
Particle contamination
Fixed particles outside focal plane
Mobile particles > 20 m m
Fixed particles on focal plane > 20 m m
Mobile particles > 10 m m and < 20 m m
Fixed particles on focal plane > 10 m m and < 20 m m
Particles < 10 m m
Wafer lot acceptance (see section Wafer Lot Acceptance on page 6)
Glass lot acceptance (see section Glass Lot Acceptance on page 6)
Assembly lot acceptance (Table 7 on page 6)
Periodic testing (Table 8 on page 7)
Screening (Table 9 on page 7)
Calibration data
Visual Inspection + particle mapping
Table 11. MAXIMUM RATINGS
Engineering Model
100
50
150
5
5
25
10
1200
1500
N/A
0
0
20
N/A
NO
NO
NO
NO
NO
NO
NO
Flight Model
20
20
50
0
0
2
0
1000
1250
N/A
0
0
10
N/A
Yes
Yes
Yes
Yes
Yes
Yes
Yes
No.
1
2
3
4
5
6
Characteristic
Any supply voltage except VDD_RES
Supply voltage at VDD_RES
Voltage on any input terminal
Soldering temperature
Operating temperature
Storage temperature
Min
–0.5
–0.5
–0.5
NA
–40
–55
Typ
3.3
3.3
3.3
NA
NA
NA
Max
+7.0
+5.0
Vdd + 0.5
260
+85
+125
Unit
V
V
V
° C
° C
° C
Remarks
3.3 V for normal operation; up to
5 V for increased full well capacity.
Hand soldering only; See Solder-
ing Instructions on page 1
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
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